Thermal Shock Chamber
Lower limit Temperature:-75℃
Upper limit Temperature:+220℃
Temperature Range:-70℃～+220 ℃
The specimen automatic transferred from cold chamber to hot chamber by basket
Temperature Recovery Time:Within 5 minutes
Refrigerant: Environmental refrigerant
Semiconductor-Grade Thermal Shock Chamber with Precision Temperature Control
Thermal shock testing demands precision, reliability, and compliance with rigorous industry standards. A Thermal Shock Chamber is essential for validating product durability under extreme temperature cycling, particularly in semiconductor, automotive, aerospace, and electronics manufacturing. Xi'an LIB Environmental Simulation Industry is a professional manufacturer of high performance thermal shock test chamber for meeting the rigorous demands of semiconductor grade applications. We build equipment that manages temperature overshoot, transition speeds and long term structural integrity, so you can get accurate, repeatable test results, while decreasing your operating expenses and compliance concerns.
Specification of Thermal Shock Chamber
Model | TS-162 | TS-340 | TS-500 | TS-1000 |
Internal Dimensions (mm) | 300*300*250 | 450*450*360 | 650*650*500 | 850*850*700 |
Overall Dimension (mm) | 1560*870*1545 | 1710*1020*1845 | 1910*1220*2265 | 2110*1420*2665 |
Interior Volume (mm) | 22L | 72L | 211L | 505L |
Loading Capacity | 20kg | 30kg | 50kg | 60kg |
Upper limit Temperature | +220℃ | |||
Heating Time | Ambient ~ + 200℃, within 30 minutes | |||
Lower limit Temperature | -75℃ | |||
Cooling time | Ambient ~ -70℃, within 30 minutes | |||
High Temperature Exposure Range | Ambient +20 ~ +200°C | |||
Low temperature Exposure Range | –65 ~ -5°C | |||
Temperature Fluctuation | ≤±0.5℃ | |||
Temperature Deviation | ≤±3 ℃ | |||
Temperature Recovery Time | Within 5 minutes | |||
Cooling System | Mechanical compression refrigeration system | |||
Controller | Programmable color LCD touch screen controller, Ethernet connection | |||
Safety Device | Over-temperature protection, Over-current protection; Refrigerant high-pressure protection; Earth leakage protection | |||
Exterior Material | Steel Plate with protective coating | |||
Interior Material | SUS304 stainless steel | |||
Observation Window | Interior lighting, double-layer thermo stability silicone rubber sealing | |||
Standard Configuration | 2 shelves | |||
Product Details
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Basket The specimen automatic transferred from cold chamber to hot chamber by basket. The basket slides vertically and smoothly through rail. | Cooling system Mechanical compression refrigeration system French TECUMSEH compressor Environmentally friendly refrigerant | Castors Install 4 castors for ease moving, and with brakes function. Caster height adjustable. |
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Why Choose Us
Precise Temperature Shock Control
LIB temperature shock chambers use advanced control technology to minimize temperature overshoot and maintain stable test conditions. The system provides accurate hot and cold zone switching for reliable thermal shock testing.
Fast Temperature Transfer Performance
The pneumatic basket system enables rapid transfer between high and low temperature zones, achieving temperature changes within ≤3 seconds and improving test efficiency for demanding applications.
Durable Structure & Thermal Stability
The chamber features SUS304 stainless steel construction for long-term high-temperature operation. Optimized insulation and anti-frost refrigeration design ensure stable performance during continuous testing while reducing energy consumption.
Global Support & 3-Year Warranty
Since 2012, LIB Industry has provided environmental test solutions to customers in 60+ countries. With global service support in the US, Canada, UK, and Malaysia, we provide:
3-year warranty & lifetime service
24/7 technical support
Replacement guarantee during warranty period if repair is impossible
Full Compliance with International Testing Standards
Our liquid thermal shock chamber and air-based systems are designed to meet:
· MIL-STD-883H Method 1011 – Thermal Shock (U.S. military semiconductor standard, global industry benchmark)
· JEDEC JESD22-A106 – Thermal Shock for chip packaging
· IPC-TM-650 Method 2.6.7 – Thermal Shock for PCB solder mask
· AEC-Q100 Rev-H – Failure Mechanism Based Stress Test (automotive chip reliability, OEM supplier qualification)
FAQ
Q: What is the difference between two zone and three zone the products?
A: Two zone systems use hot and cold compartments. Three zone systems add an ambient zone for more complex cycling profiles.
Q: How quickly can the chamber switch temperatures?
A: Basket transfer takes ≤3 seconds; recovery to setpoint ±5% takes ≤3 minutes.
Q: Is customization available for non-standard testing needs?
A: Yes. LIB specializes in custom R&D and non-standard design to meet your unique requirements.
Q: What maintenance is required?
A: Minimal. Hydrophilic evaporator fins resist frost buildup. Routine filter checks and annual calibration are recommended.
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